PCB & SMT Manufacturing
PCB and SMT identification through reflow and wave-solder process stages.
High Temperature Labels
Identification solutions for applications involving elevated-temperature processes, manufacturing environments and durable traceability requirements. Label construction can be evaluated around the process, surface and required identification method.

02 / Where and how it is used
High-temperature labels support identification in heat-exposed applications. Selection goes beyond the facestock: the complete construction needs to suit the process and the information that must remain readable.
These are common starting points; the appropriate construction depends on the specific application.
PCB and SMT identification through reflow and wave-solder process stages.
Traceability for components, assemblies and production workflows.
Part and assembly identification for heat-treatment processes and industrial traceability.
Barcode, QR code, Data Matrix and serial identification used through production.

03 / Selecting the right construction

Consider both the temperature level and how long the label is exposed.
Metal, coated surfaces, PCB-related surfaces, plastics or other substrates may require different constructions.
Determine whether the label is applied before, during or after the demanding process.
Adhesive selection should consider the surface, process and service conditions.
Text, graphics, barcode, QR code, serial number or variable data.
Determine what must remain attached and readable during and after the process.
04 / Materials, print and format
05 / Application and validation
Two applications with similar peak temperatures may need different label constructions. A suitable solution starts with the complete process, rather than one temperature number.
06 / Discuss your application
Share the surface, process conditions, identification requirements and quantity. We can evaluate a suitable construction for the application.
A short description, approximate size and quantity are enough to start.